TSP Cartridge
TSP Cartridge
Filament-type TSP sources are most popular with UHV systems since they can be turned off between sublimations and thus do not add thermally induced outgassing. The ball-type sources contain larger amounts of titanium, which means longer life when operated under conditions that use more titanium, such as higher operating pressures.
- Titanium Sublimation Combination Ion Pumps (TSP)
Product Details
- Provided on 2.75² ConFlat flange
- Bakeable to 400 °C
- Operating pressure range is 1.0–4 to 1.0–12 mbar
- Filament artridge contains three titanium-molybdenum filaments, each with 1.1 g of usable titanium
- Replacement filament package includes 12 filaments, enough for 4 replacements
- Mini Ti-ball source provides 15.2 g of usable titanium for extended operational lifetime
- Maximum Ti-ball sublimation is achieved at 300 watts of source power, while the standby power requirement is 100 watts to prevent cracking while not in use
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Vacuum and Leak Detection Reference: Formulas, Properties, and Glossary
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Agilent Vacuum Product Declarations of Conformity Reference List
Contains a reference list of Vacuum Products Declarations of Conformity. Each vacuum product is shipped with the specific Declaration of Conformity.
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